Home FOR AUTHORS Kovove Materialy-Metallic Materials 2011 Metallic Materials Vol. 49 (2011), no. 1, pp. 51- 63

Journal info

Select Journal







Webshop Cart

Your Cart is currently empty.
Info: Your browser does not accept cookies. To put products into your cart and purchase them you need to enable cookies.

Metallic Materials Vol. 49 (2011), no. 1, pp. 51- 63

Title: Bimodal grain size distributions in UFG materials produced by SPD – their evolution and effect on the fatigue and monotonic strength properties
Author: M. KORN, R. LAPOVOK, A. BOHNER, H. W. HOPPEL, H. MUGHRABI
Abstract: In ultrafine-grained (UFG) materials produced by severe plastic deformation (SPD) techniques such as ECAP (equal channel angular pressing), bimodal grain size distributions have been observed under different circumstances, for example shortly after ECAP, after rest or anneal and/or after mild cyclic deformation at rather low homologous temperature. It has been shown that the mechanical monotonic and fatigue properties of some UFG materials can be modified (sometimes enhanced) by introducing a bimodal grain size distribution by a mild annealing treatment which leads, in some cases, to a good combination of strength and ductility. Here, the conditions under which bimodal grain size distributions evolve by (adiabatic) heating during ECAP and during subsequent annealing or cyclic deformation will be explored, and the effects on the mechanical properties, as studied by the authors and as reported so far in the literature, will be reviewed and discussed. In particular, the role of temperature rise during ECAP will be considered in some detail.
Keywords: UFG, ultrafine-grained microstructure, bimodal grain size distribution, fatigue life enhancement, grain coarsening, ECAP temperature rise
Published online: 08-Feb-2011
Year: 2011, Volume: 49, Issue: 1 Page From: 51, Page To: 63
doi:10.4149/km_2011_1_51
Price: Call for Pricing





© AEPress s.r.o
Copyright notice: For any permission to reproduce, archive or otherwise use the documents in the ELiS, please contact AEP.