Home Kovove Materialy-Metallic Materials 2015 Metallic Materials Vol. 53 (2015), no. 2, pp.79-84

Journal info

Select Journal

Webshop Cart

Your Cart is currently empty.

Info: Your browser does not accept cookies. To put products into your cart and purchase them you need to enable cookies.

Metallic Materials Vol. 53 (2015), no. 2, pp.79-84

Title: Influence of melt overheating on microstructure and soldering properties of SnBiCu solder alloy
Author: Z. H. CHEN, X. D. BAO, Z. J. HUANG, G. WANG, X. B. ZHU, Y. F. SUN

Abstract: The melt structure transition behaviors of SnBi17Cu0.5 solder alloy were investigated in detail. By Differential Scanning Calorimetry (DSC) and electrical resistivity method, an anomalous change has been found in 835–875 °C during heating process on the ρ-T and DSC curves. It reveals that a liquid-liquid structure change (LLSC) occurs in the melt. Through melt overheating treatment, the influence of LLSC on solidification process and material properties has been further studied: bigger solidification undercooling degree in the solidification process, finer and more dispersing solidification structure, and more importantly, the mechanical and welding properties of the solder alloy have also been obviously improved.

Keywords: melt structure, liquid structure change, SnBi17Cu0.5 solder, soldering property, solidification
Published online: 18-Jan-2016
Year: 2015, Volume: 53, Issue: 2 Page From: 79, Page To: 84

download file

© AEPress s.r.o
Copyright notice: For any permission to reproduce, archive or otherwise use the documents in the ELiS, please contact AEP.