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Metallic Materials Vol. 55 (2017), no. 1, pp.7-12

Title: Strength and electrical conductivity of roll-bonded Cu/Al-Mg-Si/Cu clad composite
Author: W.-N. KIM, S. I. HONG
Abstract: Tri-layered Cu/Al-Mg-Si/Cu clad composite was cold roll-bonded, and its mechanical/electrical properties were studied. In the roll-bonded and aged Cu/Al-Mg-Si/Cu clad composite, neither interfacial reaction layer nor interface defects were observed. The strength as high as 415 MPa with the conductivity of 82 % IACS was attained in 3-ply light-weight Cu/Al-Mg-Si/Cu clad composite. The ductility and conductivity of clad composite are increased appreciably with heat treatment at 175 °C. After mechanical testing, the interface crack propagation and fracture in the well-bonded interface between metallic Cu and Al occurred in softer Al matrix. The increase of detached Al lumps onto the separated Cu side in clad composite heat-treated at 175 °C strongly supports that the interface bonding can be enhanced during aging of Al-Mg-Si alloy layer in Cu/Al-Mg-Si/Cu clad composite. The increased ductility in the aged Cu/Al-Mg-Si/Cu clad composite can be attributed to the enhanced interface bonding and precipitation in Al-Mg-Si layers.
Keywords: composites, clad, roll bonding, interface, strength, conductivity
Published online: 14-Mar-2017
Year: 2017, Volume: 55, Issue: 1 Page From: 7, Page To: 12
doi:10.4149/km_2017_1_7


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