Home FOR AUTHORS Kovove Materialy-Metallic Materials 2010 Metallic Materials Vol. 48 (2010), no. 6, pp. 353 - 359

Journal info

Select Journal

Webshop Cart

Your Cart is currently empty.

Info: Your browser does not accept cookies. To put products into your cart and purchase them you need to enable cookies.

Metallic Materials Vol. 48 (2010), no. 6, pp. 353 - 359

Title: Influence of Sb and Cu in Sn-Sb-Cu alloys on wetting of Cu and Cu-solder-Cu joint strength

Abstract: The influence of Sb (5, 10 and 20 at.%) and copper (0, 1.8, 3.4 and 3.7 at.%) in lead-free Sn-Sb-Cu solder on wetting of copper substrate at the temperature 623 K (350 °C) in air using flux and in N2+10H2 gas until 1800 s was studied by the sessile drop method. Wetting angle in air increases with the increase of Sb and Cu concentration in the solder whereas wetting in N2+10H2 practically does not depend on the Sb concentration. The influence of antimony and copper in Sn-Sb-Cu solder on the strength of Cu-solder-Cu joints prepared at the same conditions as wetting was also studied. Shear strength of the joints produced in air and in the gas mildly decreases with increasing amount of antimony and copper in both cases with the production of the joint in air as well as in the gas.
The solidus and liquidus temperatures as well as heats of melting of all solders in ribbon and bulk shape were determined by differential scanning calorimetry (DSC) method.

Keywords: lead-free solder, antimony, wetting, Cu-solder-Cu strength
Year: 2010, Volume: 48, Issue: 6 Page From: 353, Page To: 359

download file

© AEPress s.r.o
Copyright notice: For any permission to reproduce, archive or otherwise use the documents in the ELiS, please contact AEP.